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MEMORY SOCKET
I/O SOCKET
FPC/FFC
SATA
DC JACK
BATTERY/POGO
RF/COAXIAL
SWITCH
BOARD TO BOARD
WIRE TO BOARD
CABLE HARNESS
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USB3.0 DIP Type
209A-DG02 :  Middle Board Mount DIP Type, 30u" Gold Plating

SPECIFICATION

 

MATERIAL AND FINISH:

£ª Insulator Material: Nylon-4T, UL94V-0, Color: Blue

£ª Contact Material: Copper Alloy

£ª Contact Plated:

Contact Area Plated: 30u¡± Gold Plated

Solder Area Plated: 100~200u" Tin Plated

Underplated: 80u" Nickel Plated

£ª Shell Material: SPCC,t=0.3

£ª Shell Plated: Nickel Plate

£ª Current Rating: 1.8 Amps Max (PIN1,PIN4) all other contacts 0.25A Min

£ª Contact Resistance: 30m ohms Max

£ª Insulation Resistance:100M ohms Min

£ª Dielectric Withstanding Voltage: 100V AC/minute

£ª Temperature: -20¡Éto +85¡É