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MEMORY SOCKET
I/O SOCKET
FPC/FFC
SATA
DC JACK
BATTERY/POGO
RF/COAXIAL
SWITCH
BOARD TO BOARD
WIRE TO BOARD
CABLE HARNESS
PHONE JACK
 
 
Landing SMT Type
116C-SGO0-R :  Landing, Top Mount, SMT Type

SPECIFICATION

 

MATERIAL AND FINISH

1.Base Material: Nylon-9T(G2458HF),UL94V-0,Color:Black

2.Cover Material: Nylon-9T(G2458HF),UL94V-0,Color:Black

3.Slider Material: Nylon-9T(G2458HF),UL94V-0,Color:Black

4.Contact Material: Phosphor Bronze(C5210R-SH),t=0.3mm

5.Bearing Material: Phosphor Bronze(C5191)

6.Switch Actuator Material: SUS-304(JISG4313), t=0.4mm

7.Rock-Arm Material: SUS-304(JISG4313), t=0.15mm

8.Spring Material: SK85(K5),HRc45 ~47 , t=0.3mm

9.Underplate: 40u" Nickel Plated

10.Contact Area Plated: 30u" Gold Plated

11.Solder Area Plated: 100u" Tin Plated

12.Spring Plated: 40u" Nickel Plated

13.Bearing Plated: 50u" Nickel Plated

14.Tach Switch:

14-1.Body Material: LCP(LA130),UL94V-0,Color:White

14-2.Cover Material: S.P.T.E

14-3.Contact: Phosphor Bronze(C5210R-EH),t=0.16mm /Tin Plated

14-4.Terminal: Brass(C2680R-H),t=0.3mm/Tin Plated

14-5.Silicone Rubber: Steel/Tin Plated

15.Current Rating: 10 uA Min. / 1A max.

16.Contact Resistance: 100 milliohms Max.

17.Insulation Resistance: 1000 meg ohms Min.

18.Dielectric Withstanding Voltage: 750 V AC/minute

19.Operation Temperature: -40C to +85C

20.Card Insertion Force: 10 N Max.

21.Card Extraction Force: 1 N Min. / 10N Max.

22.Contact Force: 0.25 N Min. / 0.5 N Max.

23.Card Detection Switch: Normally Open

24.Durability: 200,000 Mating Cycles