¹æ¼öÄ¿³ØÅÍ
MEMORY SOCKET
I/O SOCKET
FPC/FFC
SATA
DC JACK
BATTERY/POGO
RF/COAXIAL
SWITCH
BOARD TO BOARD
WIRE TO BOARD
CABLE HARNESS
PHONE JACK
 
 
Standard Type
116B-DBOA-R :  Standard, Single Port, Top Mount, DIP Type

SPECIFICATION

 

Insulator material: P.B.T+30% GF ul94v-0,color:black

Cover Material£ºPBT+30% Glass Filled UL94V-0, Color :Black

Contact material: Phosphor bronze

Contact plated: underplate: 4u¡± Nickel All over

Contact Area Plated: 3u¡± 15u¡± 30u¡± Gold plating

Solder Area Plated: 100u¡± Tin Plated

TDB Insulator Material: PBT+30% glass filled, UL94V-0, color black

TDB Contact Material: Brass

TDB Contact Plated: Tin Plated

Bare copper line-T U style 0.5*3*10*3

Rivet: brass nickel plated 50u¡± OD3.6*9.2mm

Current rating: 1amp AC/DC

Insulation resistance: 1000M ohms min.

Contact resistance: 100m ohms max.

Dielectric withstanding voltage: 500v AC.

Operating temperature:-40¡Éto + 60¡É

Card ion force: 1kg Max.

Card separation force: 102g min.

Contact retention force: 100g min. per pin

Mating cycles: 100,000 cycles min.

Card delection swith